Cov ntawv luam hluav taws xob
Kev Nyab Xeeb Ntshav Kho Kom Zoo rau Cov Ntawv Sau Khoom Siv Hluav Taws Xob & Cov Khoom Siv Yooj Yim
Advanced Ntshav Kho Kev Kho Cov Khoom Ua Kom Tsim Nyog Adhesion txhim kho siv hauv:
- Saj zawg luam tawm cov khoom lag luam (FPCs) {- ill illing polyimide (PI) thiab tsiaj cov yeeb yaj kiab rau kev sib koom tes
- OLED / LCD qhia - ua ntej- Lamination kev kho ntawm ultra- daim iav nyias (utf
- Nyias {-} zaj duab xis roj teeb- npoo ov ion electrode ntawv
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Cav |
Kev daws ntshav |
KEV PAB CUAM |
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NYig nto zog polymers |
Oxygen / Argon / Ntshav Qhia Fydroxyl ({{{{}} Oh oh {} COoh) Pawg |
Hu rau lub kaum sab xis txo los ntawm 80℃→ 30℃hauv<1s |
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Tawm -} Cov ntaub ntawv rhiab |
Pulsed DBD ntshav ntawm<50°C prevents thermal damage |
Nanoscale hloov kho (<10nm depth) only |
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Adhesion tsis ua haujlwm ntawm UTFG |
DCSBL ntshav tshem tawm hydrocarbons thaum ntxiv cov pa oxygen ua haujlwm |
10⁵ × Reforely txo hauv rgg ncig |
Cov khoom siv - Cov txheej txheem tshwj xeeb
- Cov yeeb yaj kiab polyimide (Kapton®)
Txheej Txheem: N₂ / H₂ Ntshav Ntawm 20KHz, 7Kv
Qhov tshwm sim: 60% siab dua hauv qab adhesion vs. Corrona Kev Kho Mob
- Ultra - Iifile iav (UTFG)
Txheej Txheem: Diffuse LOPLANAR Deg Barrier Tawm (DCSBD)
Qhov tshwm sim: 40% kev tsim txiaj nce hauv pedot: pss txheej txheej
- Li {{0} ion electrode ntawv nyiaj
Txheej Txheem: Cov ntshav Plasma nrog nws / O₂ Mix
Qhov tshwm sim: 15% dua tev zog hauv cov laminated cell
- Engineer -}} ™ npaj daws rau kev tawm -} Cov ntaub ntawv rhiab
Peb lub tshuab ua ke tiag tiag -} lub sij hawm impedance xyuas thiab adaptive zog tswj kom tiv thaiv arcing rau:
Kub -} rhiab bio {{}} polymers (piv txwv li plga scaffolds)
Micro - qauv ito nto
Cov roj teeb hluav taws xob ntxig separators
- Hu rau peb pab neeg ua ke saum npoo rau:
▶ ︎ Cov khoom sib xyaw kev ntsuas (xam. WCA / sem / xps cov ntaub ntawv)
▶ Txheej txheem tsim nyog nrog koj cov substrates (PI / COP / Cwj)
▶ ︎ ntawm -}} chaw ntawm qhov chaw opameter kom tiv thaiv kev tawm tsam